The chip design on the heat sink is also used in the new Sic power module with aluminum tiles with integrated cooler, where the cooler consists of a copper-plated liquid flow aluminum nitride cooler on both sides and an optimized needle fin structure. The heatsink measures 48 x 36 mm, is 3.6 mm thick (including metal plating) and weighs 10 g. The cooler with china tile trim the typical base plate weighs 60 grams, so the weight of the cooler itself is greatly reduced. The mechanical stress can be caused by the pressurized sintering process, so we have done a lot of research on the structure under the chip, simulating the pressure acting on the ceramic. So the structure under the chip is very similar, so there is the same mechanical pressure during the 10 MPa pressure sintering process, and the pressure at 20 MPa is not a problem for the aluminum tile cooler, and from our shear tests, the contact of the metallization layer is good.

The power module with needle fin ceramic cooler has a thermal resistance of 0.15 K cm2/W from chip to cooler, and the three modules are connected in parallel for a typical drivetrain inverter design, with a coolant flow of 7.5 l/min and a pressure drop of 200 mbar comparable to conventional coolers. A very interesting power module has been built based on aluminum tile cooler technology, which we have demonstrated with high thermal properties and low inductance for high switching performance. We built a prototype system with a SiC device using pressure-assisted sintering technology with bonding wires on the top of the chip, capacitors and DC and AC connections on the back. So we're now planning additional demonstrations and electrical tests of the performance.

The ceramic plate module significantly stainless steel tile edging reduces the size of the drive inverter by providing more efficient cooling and allows vertical interconnection within the aluminium tile when aluminum tiles are formed, further reducing the size and improving electrical performance. While in the development of the advanced power module for integrated systems and device technology in the development of this module, the top of the classic module is a Sic device with aluminum tiles, but today we now have new possibilities to build power modules using ceramic plate cooling with integrated cooling. We have the possibility of using the back of the cooler for capacitors or terminals, that is, connections from the top to the bottom, or we can have wires pass through the ceramic plate itself to metallize the back, which gives us low inductance because the capacitors are closer to the semiconductor device. Engineers will use the siC power device for the half-bridge converter directly on the aluminum nitride tile developed by the project, which has thermal properties of more than 170W/mk. The ceramic plates on the cooler are directly metallized, so you don't need a middle layer, which means you can halve the thermal resistance, which is a big advantage with better thermal properties, lighter weight and less space. An internal cooling structure can be built using aluminum tiles, for example as a pin fin structure, and the electrical connection can run outside or be included in the substrate, which will be tile trim manufacturers used on the connection via a pin fin that is not underneath the SiC device. Tested for a single-sided substrate cooled by half.