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2025-12-17 17:52:35 -

Fine-Pitch Wire Bonding: Enabling Next-Generation Semiconductor Devices

The global wire bonding market continues to play a critical role in the semiconductor value chain, supporting the assembly and packaging of integrated circuits across a wide range of applications. In 2024, the wire bonding market was valued at US$ 4.5 billion and is projected to reach US$ 8.0 billion by 2035, expanding at a CAGR of 5.3% from 2025 to 2035. This steady growth reflects the...

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