Electronic Board Level Underfill Material Market Growth, Share,...

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2025-11-27 10:38:20 -

Electronic Board Level Underfill Material Market Growth, Share, Trend and Forecast Analysis By FMI

The global electronic board level underfill material market is poised for steady expansion through 2035, driven by miniaturization, high-performance semiconductor packaging, and rising demand in 5G infrastructure, AI hardware, and electric vehicles. According to Future Market Insights (FMI), the market is valued at USD 362.9 million in 2025 and is projected to hit USD 597.7 million by...

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